|
| 衬底基片表面加工变形问题研究 |
| Study on the Processing Distortion of Substrates |
| |
| DOI：10.3969/j.issn.1671-5322.2009.03.002 |
| 中文关键词: 衬底片 加工变形 化学机械抛光 抛光垫 |
| 英文关键词: substrate processing distortion chemical mechanical polishing polishing pad |
| 基金项目:江苏省自然科学基础研究项目，江苏省科技厅科技攻关项目，盐城工学院机械工程重点建设学科开放项目 |
|
| 摘要点击次数: 4332 |
| 全文下载次数: 3899 |
| 中文摘要: |
| 在分析衬底基片加工工艺和衬底基片加工试验的基础上,得出导致衬底基片表面变形的因素有:支承盘精度、粘片的方法、衬底基片的表层应力、抛光垫的材质.提出采用较高刚度和硬度的陶瓷支承盘和及时修整,使支承盘保持较高的表面形状精度.采用真空粘片,使衬底基片紧密贴合支承盘.通过双面研磨、双面抛光以及基片表面处理使得衬底基片两面应力一致.根据不同的衬底基片选择硬度适当的抛光垫,从而有效解决衬底基片表面加工变形问题.实现了衬底基片平面度小于5 μm. |
| 英文摘要: |
| Based on the analysis of processing technology and experimentation about substrates,the factors that bring on processing distortion include precision of carrying pad,method of affixing,stress of substrate surface,material of polishing pad.In order to reduce processing distortion,some measures have been put forward.To use high rigidity and hardness carrying pad make the pad has good shape precision.To affix substrates on vacuum make substrates stick carrying pad.Polishing pad has been selected according to substrate.The distortion of substrates surface is less than 5 micron. |
|
查看全文
查看/发表评论 下载PDF阅读器 |
| 关闭 |