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| 某小型化电子设备热设计及试验验证 |
| Thermal Design and Experimental Verification of a Miniaturized Electronic Equipment |
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| DOI：10.3969/j.issn.1671-5322.2011.02.012 |
| 中文关键词: 热设计 电子设备 小型化 |
| 英文关键词: Thermal design Electronic equipment Miniaturization |
| 基金项目: |
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| 摘要点击次数: 4425 |
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| 中文摘要: |
| 热设计是影响电子设备可靠性的一个重要因素,电子设备的小型化对热设计提出了更高的要求.对某小型化电子设备在方案阶段进行了热设计及热仿真分析,并对产品实物的散热进行了试验验证,探讨了小型化电子设备的一种热设计及试验验证方法. |
| 英文摘要: |
| Thermal design is very important for reliability of electronic equipments.Due to miniaturization of electronic equipment,the higher request is put forward to the thermal design.Thermal design and thermal analysis of the miniaturization of an electronic equipment were carried out in the conceptual stage,and the heat distribution of the product was verified through experiment.A method of thermal design and experiment was argued about miniaturization of electronic equipment. |
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