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| 基于 ANSYS 有限元的 Ag－Cu－Ti合金钎焊金刚石磨粒残余应力分析与优化研究 |
| Re search on Thermal Stress of Brazed Diamond Grain with Ag-Cu-Ti Brazing Alloy Based on ANSYS |
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| DOI： |
| 中文关键词: ANSYS 金刚石 残余应力 Ag-Cu-Ti合金 包埋深度 |
| 英文关键词: ANSYS diamond residual stress Ag-Cu-Ti alloy embedding depth |
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| 摘要点击次数: 5914 |
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| 中文摘要: |
| 研究金刚石包埋深度分别为20％、40％、50％、60％、80％的钎料对单层钎焊金刚石工具性能的影响。利用有限元软件ANSYS对Ag－Cu－Ti合金钎焊金刚石过程中形成的残余应力进行数值模拟，采用线性和静态的分析方法。研究结果表明，最大应力值位于金刚石和钎料界面结合处的最底部，应力从金刚石底部到顶部逐渐减小，金刚石受拉应力，钎料和工具基体受压应力。当金刚石的包埋深度介于20％与40％之间时，钎焊残余应力最小。 |
| 英文摘要: |
| The influence of the solder layer thickness to the properties of monolayer brazed diamond tools was studied .The em-bedding depth of diamond was 20%, 40%, 50%, 60%, 80%, respectively .When finite element software ANSYS was used to study the residual stress of diamond brazed with Ag -Cu-Ti alloy brazing , the brazing process could be thought as an isothermal process.Therefore the linear and static analysis method were used to research the residual stress formed during brazing process . Results show that the maximum stress appears at the interface between diamonds and brazing alloy , stress decreases from the bot-tom of the diamond to the top of the diamond;the diamond abrasive endures tensile stress , however , the brazing alloy and tools substrate endures compressive stress .When the embedding depth of the diamond is between 20%and 40%, the residual stress has the minimum value . |
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